“Shadow” post-processing of semiconductor manufacturing is a big trend, and Lapidus is the trump card – News Switch
半導体製造の“日陰”後工程が一大トレンド、ラピダスが切り札に – ニ ュースイッチ
先端パッケージングの実現に向け、特に重要なのがチップと基板をつなぐ中継部分の 「インターポーザー」だ。ラピダスはシリコン製ではなく、６００ミリメートル 角…
https://newswitch.jp/p/41437
“Shadow” post-processing of semiconductor manufacturing is a big trend, and Lapidus is the trump card – News Switch
In order to realize advanced packaging, the interposer, which is the relay part that connects the chip and the substrate, is particularly important. Lapidus is not made of silicon and is 600mm square …
*Translated using Google’s automatic translation function. If there are any mistranslations, please contact us.
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